3. DEK Vision Automatic Paste Screen Printing Machine

Features: Full vision alignment system, excellent printing precision and reproducibility of alignment; a new generation of COGNEX 8100 vision system, 2D steel plate (metal stencil) and printed circuit board fully correspond; instant SPC data system, process control is good Helper; ProFlow Squeegee, patented Vortex foam wiper design; Completely corrects the shortcomings of traditional scrapers; Vertical extrusion, PTH absolute squeezing; Refillable solder paste completely closed and no contact with air; Speed ​​150mm/s; can become 6 kinds of commonly used metal template size, no additional fixtures; automatic metal template positioning, convenient and quick; there are three models of Infinity, Horison, ELA can correspond to different needs.

The DEK full-vision automatic solder paste screen printing machine is shown in Figure 23.

With the characteristics of the latest model DEKELA of YZK:

YZK latest model, more streamlined mechanism design, to play a more complete function; visible no-fuse switch and full modular design, overhaul easier; the latest metal template positioning scale design, no time to find the Mark point, Rapid positioning of metal stencils; new design of metal stencil fixtures, eliminating the trouble of traditional drilling fixed metal stencils; using WindowsNT operating platform, more stable and rapid operation.

Electronic screen printing technology innovation banner

No need to dive into what DEK is, but many of DEK's innovations in the field of high-end screen printing can be considered as landmarks in screen printing technology. Therefore, it is not an exaggeration to say that DEK is a banner for screen printing technology! I believe The following introduction will greatly enlighten those who love and care about the progress of China's screen printing business.

1, DEK high-end micro-scale SMT screen printing machine - Galaxy

DEK announces the launch of the high-end micron SMT screen printer, the Galaxy. The inherent traceability and 10μm accuracy advantages of the new high-end micron-level Galaxy screen printing platform and its high-volume, high-precision mass-compression printing technology can create profitable opportunities in the semiconductor packaging field.

Galaxy can provide process and machine solutions for semiconductor advanced packaging applications, including wafer bumps, substrate bumps, wafer and substrate bumps, epoxy backside wafer coating, and FCD processes.

The new Galaxy platform is designed for wafer-level, substrate- and board-level high-precision screen printing applications. Packages include CSP (with wL-CSP), Flipchip, and micro-BGA, both of which can be commercialized using Galaxy. produce.

The Galaxy combines new mechanical features including linear motor technology for speed, accuracy and reliability. Advanced optical inspection performance enables zero-error optical inspections at high yields.

In addition, as SMT assemblers are actively expanding their future, wafer level and substrate pole back-end closure capabilities are gradually needed. With Galaxy, they can use very familiar devices to achieve this goal, and can easily follow the lead of components. The inevitable tendency of the foot spacing to accelerate again and again reduces itself to the mainstream of production where high precision is required.

Galaxy's new platform can meet the speed and precision requirements of future SMT assembly and advanced semiconductor packaging. The advent of the Galaxy means that the semiconductor packaging process can immediately benefit from its advanced motor control and machine vision capabilities, complementing the further development of production-scale chip scale package (CSP) production. The introduction of this new platform ensures that SMT assembly companies can carry out various process designs with confidence and have the necessary advanced technology as backing to implement various printing processes between the limits of assembly and packaging.

The performance of Galaxy really belongs to the advanced generation of SMT screen printing presses.

2. DEK's advanced bulk extrusion technology and ProFlex technology

Currently, semiconductor component assemblers all over the world use advanced batch printing technology to place solder balls and fluxes, underfill materials, and sealants on flip-chip and chip-scale packaging devices. , Thermal Interface Materials (TIM) and Mounting Adhesives. In order to respond to this demand, DEK has developed the patented ProFlowEirEkt extrusion technology, which is a very cost-effective technology, and unified these technologies in a new generation of printing platforms through the high-end Galaxy SMT screen printing machine, creating a professional semiconductor packaging manufacturer. Brand new solution.

ProFlowEirEkt is able to realize high-precision screen printing in commercial batches with a resolution of over 150 μm. This so-called “squeeze” concept is a process that is added before the solder paste is stenciled. Its purpose is to hollow out the metal pattern of the metal stencil. The amount of paste in the paste is strictly quantified to ensure the accuracy of the printed solder paste geometry.

The DEKProFlex technology was introduced and used in conjunction with high-precision mass-compression technology. ProFlex can be used as an option for installing new machines in the manufacturing plant, as well as machine performance upgrade (MPU) components for existing machines. ProFlex is the result of an in-depth study of the behavior of screens in the demolding phase by DEK. Because screen printing (metal stencils) can have a major impact on solder paste release during mold release, screen cleaning is particularly critical for extremely small openings. The need for frequent screen cleaning operations reduces production throughput, and ProFlex reduces the number of screen cleaning operations by changing the screen behavior during the demolding phase, minimizing open hole blocking. ProFlex changed the way the screen was moved during the demolding stage, which greatly improved the solder paste release performance.

DEK not only opens the door to high-volume manufacturing of next-generation component packages that require fine-grid arrays, but also to SMT for next-generation chip-scale package components. Assembly road.

High-precision mass extrusion technology is becoming the technology of choice for many processes. It enters Galaxy with ProFlex technology at the same time, enabling Galaxy to cover the rich process expertise accumulated in high-end SMT screen printing, through excellent component manufacturers and packaging. Obtained by expert cooperation, this sophisticated technology and technology are further improved.

Galaxy, which has been synthesized through a variety of excellent technologies, will be the key to challenging the next generation of application screen design rules.

3. The speed and cost advantages of wafer backside coating process introduced bulk extrusion printing technology

Based on a cost-effective bulk extrusion printing platform, DEK has successfully developed a high yield wafer backside coating process that will exceed the 12.5 μm Total Thickness Deviation (TTV) requirement defined by most wafer processing experts. This new process is compatible with bottom-fill or adhesive-type coatings. Typically, a layer with a nominal thickness of 50 μm is applied to the backside of the semiconductor wafer prior to dicing.

TTV is a key success factor for all wafer backside coating processes. It provides new opportunities for semiconductor packaging specialists to use high-precision bulk extrusion technology to increase production and reduce unit packaging costs. Moreover, the equipment used is inherently more flexible than dedicated wafer backside coating machines, providing customers with a higher return on investment.

The new process is compatible with DEK's metal screen and latex screen technology. Metal screens allow the use of larger particulate fillers, such as packaging materials (ie, screen prints), and a completely smooth surface coating. Grid-mounted screens allow other materials such as thermoplastic adhesives to be applied precisely and at high speed. In every application, machine and screen technology can achieve strict control of print thickness and ensure high-performance stability.

In the field of wafer backside processing using high-precision bulk extrusion printing technology, comprehensive process application services include screen printing (metal stencil technology), mesh size, latex thickness, metal screen thickness, doctor blade or ProFlow selection , as well as machine parameter settings and other new screen printing technology, not repeat them here.


4. DEK Frame Separable Screen (VectorGuard) and Variable Print Printing (Pump Printing)

(1) DEK frame separable screen

DEK Frame Detachable Vector Guard (VectorGuard) has the advantage of being easier to transport, manage, store and convert products. The metal mesh installed with the frame is easier to store and manage than the standard fixed installation screen. With a sashable stencil, the metal slats can be stored in convenient and space efficient hanging category Storage cabinets without having to send each frame back to the screen supplier for calibration and refurbishment.

The metal mesh can be automatically tensioned before each use to ensure that the printed circuit board is optimally sealed to the gasket and that efficient screen/printed circuit board separation is achieved after each printing cycle. Mesh Frame The detachable screen has a specially designed aluminum frame at the edge of the metal mesh to enhance rigidity and ease of use. Now, even without gloves, operators can easily and safely transport and load a detachable screen.

Compared with the standard screen system, the installation of the screen frame detachable screen is also simpler, because it is not necessary to carry out the alignment of the hanging tooth and the hole groove, because the screen system does not load the baseline, and no special metal mesh pair is required. Bit; all operations can be performed automatically. When installed in the machine, the operator can perform quicker, safer, and more accurate product changes with minimal manual effort and little need for training. At the same time, because the mesh frame detachable screen has a stronger rigidity, the screen plate can be cleaned after being detached from the frame without using a cleaning jig.

As the life cycle of some electronic products becomes shorter and shorter, and the cost requirements are continuously shrinking, manufacturers are asking their manufacturing and process partners to respond. Therefore, the new type of frame detachable screen is flexible and innovative. The precision screen system is very important. The system ensures that the loss of solder paste can be minimized even when the newly hired staff operates.

Net frame separable screen plate is provided with standard thickness to meet the requirements of most SMT assembly processes. DEK can also provide metal meshes with special measurement specifications as required. The screen is compatible with almost all modern printing platforms, including all DEK screen printing platforms starting with the DEK248 machine.

The main features and options of the sash separation screen:

〉 Laser-cutting metal mesh - ±5μm accuracy across the entire printed area

〉Using traditional screen design guidelines - holes less than 100μm; gaps of 50μm

〉 Standard metal mesh thickness - 100-200μm

〉More options include -75, 250, 300μm

〉The overall thickness of the metal mesh (including the aluminum frame - 5μm)

Frame size:

248 and 260-584.2mm x 584.2mm (23 inches x 23 inches)

265-736.6mm x 584.2mm (29 inches x 23 inches)

Other kits - 736.6mm x 736.6mm (29 inches x 29 inches)

(2) DEK